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There s nothing worse than discovering that you need to reinstall Windows for some reason. Not only do you have to take the time and make the effort to reinstall the operating system again, you also have to ensure that you have drivers for all your hardware, find and reinstall all the applications you use regularly, reload all your personal data, and reconfigure all of the system s options so that it s exactly the way you used to have it. Rather than go through this rigmarole, you can use a Windows 7 feature called System Image Backup to create what is called a system image or snapshot. This image which is essentially a huge backup file contains the entire contents of your PC as it existed the day you created the image. If you need to recover your entire PC, you can simply restore the system image and get right back to work.

This feature has two major functions: inserting a body as the starting point for a new part, and inserting a body to be used as a tool to modify an existing part. Notice that the basket part shown in Figure 26.11 and Figure 26.12 also uses Insert Part to put together bodies to form a finished part. When you use Insert Part, there is no Insert Part feature that becomes part of the tree. Instead, a part icon is shown with the name of the part being inserted as a feature. Also notice in Figure 26.19 that the Launch move dialog option appears at the bottom, and is on by default. This option launches the Move dialog box after you insert the part. This Move feature is the same as the Move/Copy Bodies feature, with the same options (translate or rotate by distance or angles, or use assembly-like mates to position bodies). Insert Part is used in many situations, some of which are covered in s 11 and 28 in the sections on Skeleton techniques and Master Model.

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You can tap into these environment variables from within your scripts by using the environment variable name preceded by a dollar sign. This is demonstrated in the following script:

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42 (1994) 100 J C King, and C Hu, "Effect of Low and High Temperature Anneal on ProcessInduced Damage of Gate Oxides," IEEE Electron Device Lett EDL-15, 475 (1994) 101 R Rakkhit, F P Heiler, P Fang, and C Sander, "Process Induced Oxide Damage and Its Implications to Device Reliability of Submicron Transistors," IEEE IRPS Proc 293 1993 102 C T Gabriel, and M J Weling, "Gate Oxide Damage Reduction Using a Protective Dielectric Layer," IEEE Electron Dev'ice Letters EDL-15, 269 (1994) 103 Y Yunogama, T Mizutani, K Suzuki, and S Nishimatsu, "Radiation Damage in Si0 2/ Si Induced by VUV Photons," Jpn J 4ppl Phys 28, 2172 (1988) 104 M Sherony, A J Chen, K R Mistry, D A Antoniadis, and B S Doyle, "Comparison of Plasma-Induced Charging Damage n Bulk and SOI MOSFETs," IEEE Int SO1 Conf 21 (1993) 105 S Ma, private communication 106 T.

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